产品可靠性测试宣传册(CTI华测)
简介INTRODUCTION随着社会经济的不断发展，人们的消费者水平也在不断提升，消费者在购买产品时，已经不仅仅满足于产品的外观和功能，产品的可靠性已成为产品质量的重要部分。
CTI可靠性分析测试中心拥有全面的可靠性测试设备和经验丰富的测试分析团队，能帮助企业找出产品在设计、制造或使用中的潜在性问题，寻找改善方法并解决问题，提升产品质量与可靠性。
As the fast development of electrical and electronic industry, consumers are not only satisfied with the appearance and function, but also pay attention to the reliability of the electrical and electronic products.
With comprehensive testing equipment and experienced testing & analyzing team, CTI pinpoints the potential defects in the design, manufacturing, and usage period, and offers correction method to solve the problem, thus the product quality and reliability will be greatly improved.
可
靠性实验室
01/02
RELIABILITY LAB
机械试验 Mechanical Testing
测试项目测试范围
振动正弦、随机; 频率：1~2000Hz冲击加速度：50~30000m/s2(5~3000gn)脉冲持续时间：0.2ms~30ms跌落
负载：0~100Kg
跌落高度：300mm~2000mm 配套TP3和3轴向传感器，可做跌落分析
碰撞
负载：0~100Kg， 加速度：50~1000m/s2(5~100gn)铅笔硬度试验6B,5B,4B,3B,2B,B,HB,F,H,2H,3H,4H,5H,6H摩擦测试摩擦速度：10~120次/分钟摩擦方式：酒精、橡皮划格测试
距离：1mm,2mm
Test itemsTest scope
VibrationSine, Random; Frequency:1~2000HzShockAcceleration: 50~30000m/s2(5~3000gn)Duration of the nominal pulse: 0.2ms~30msDrop
Load: 0~100Kg
Height of fall: 300mm~2000mm
Match with TP3 and Tri-axial sensor, it can be used for the free fall analysis.
Bump
Load: 0~100Kg， Acceleration：50~1000m/s2（5~100gn）Pencil hardness 6B,5B,4B,3B,2B,B,HB,F,H,2H,3H,4H,5H,6HRub testRub speed: 10~120 times/minRub method: alcohol, rubberCross cut test
Distance：1mm, 2mm
气候试验 Climatic Testing
测试项目测试范围高温RT~300℃低温RT~-70℃
恒温恒湿5℃~95℃，5 ~98%RH温度/湿度循环-70℃~150℃，5 ~ 98%RH冷热冲击-65℃~150℃
快速温变-70℃~150℃， 25~98%RH，≦20℃/min高压蒸煮105℃~142.9℃, 75~100%RH, 0.020~0.196Mpa盐雾中性盐雾、醋酸盐雾、铜加速醋酸盐雾气体腐蚀SO2 , H2S , Cl2 , NO2 , NH3臭氧老化0~ 500pphm
UV老化UVA340, UVA351,UVB313太阳辐射辐照度, 450W/m2~1200W/m2 低气压RT~200℃，常压~10kPa防水IPX0~IPX8防尘
IP0X~IP6X
Test itemsTest scopeHigh temperatureRT~300℃Low temperature
RT~-70℃
Constant temperature & humidity5℃~95℃, 5 ~ 98%RHTemperature & humidity cycling-70℃~150℃, 5~98%RHThermal shock
-65℃~150℃
Speedy temperature change-70℃~150℃, 25~98%RH，≦20℃/minHAST（PCT）105℃~142.9℃,75~100%RH, 0.020~0.196MpaSalt sprayNSS, ASS, CASSGas corrosionSO2 , H2S , Cl2 , NO2 , NH3Ozone aging0~500pphm
UV exposureUVA340, UVA351,UVB313Solar RadiationIrradiance, 450W/m2~1200W/m2 Low air pressureRT~200℃，Normal atmosphere~10kPaWaterproofIPX0~IPX8Dustproof
IP0X~IP6X
RELIABILITY LAB
03/04
综合环境试验 Combined Environment Testing
HALT & HASS & HASA
温度：-100℃~200℃，温度变化速率:60 ℃/min Max振动台频率范围:10~5000Hz，加速度：0~50Grms
振动&温度&湿度（综合）
温度：-70℃~150℃， 湿度：25~98%RH，温度变化速率：15 ℃/min Max.频率范围：1~2000Hz，加速度：0~60gn，位移max（p-p）：50.8mm
HALT&HASS&HASATemperature: -100℃~200℃, 60℃/min Max.
Vibration frequency: 10~5000Hz, Acceleration: 0~50GrmsVibration&TemperatureTemperature:-70℃~150℃, 15℃/min Max.&Humidity(Combined)
Humidity: 25~98%RH
Frequency:1~2200Hz, Acceleration: 0~60gn, Displacement max (p-p) : 50.8mm
可靠性解决方案 Reliability Solutions
CTI拥有强大的顾问咨询团队，在产品的可靠性增长、鉴定、验收及寿命分析等方面能够提供全面、专业的解决方案。以帮助客户深入的了解、分析并提高产品的可靠性。The strong consultant team in CTI can offer comprehensive and professional solutions on reliability growth, reliability testing for qualification and production acceptance, and product life analysis, to help clients better understand and increase the product reliability.
失效分析在产品的可靠性质量保证和提高中发挥着重要作用，产品的研发、生产和使用中都需要引入失效分析工作。CTI失效分析实验室作为CTI一站式服务的重要组成部分，拥有一支经验丰富、技术精湛的服务团队，各种先进的检测、分析仪器，同时依托于CTI强大的多学科技术网络，可以为客户提供高效、准确、公正的检测、分析服务。
Failure analysis plays an important role in assuring and promoting product reliability. Failure analysis is required in product development, manufacture, and usage. As a vital part of the one-stop service, CTI Failure Analysis Laboratory is composed of an experienced and professional team, various advanced testing and analyzing instruments. Meanwhile, against the multi-disciplinary tech-net, CTI Failure Analysis Laboratory can provide you effective, accurate, and fair testing and analyzing services.
针对以下产品提供服务： Service Product:
电子电气产品：PCB、PCBA、电子元件、电子器件、电子工艺材料工业品：金属材料及构件、高分子材料及构件、涂/镀层产品、胶带产品
Electrical and electronic products: PCB、PCBA、electrical components and fittings, electrical engineering materials.Industrial products: metal materials and components, polymer materials and components, coated/ plated products, adhesive tape products.
提供服务的项目有 ： Our service project:
针对电子电气产品：失效分析服务、物理性能测试、产品分析评测针对工业品：失效分析服务、物理性能测试
With regard to electrical and electronic products: failure analysis, physical performance analysis, product analysis and assessment.
With regard to industrial products: failure analysis, physical performance analysis.
FAILURE ANALYSIS LAB
05/06
电子产品技术服务
Electronic Product Technical Service
在日益激烈的市场竞争中，产品的质量与可靠性越来越受到买家和消费者的关注，失效分析实验室可以针对以下产品提供检测及分析服务。
电子元器件：电阻、电容、电位器、连接器、继电器、开关器件、二极管、三极管、MOSFET、集成电路、光电模
块、LED 器件、光伏器件。
In the ever competitive market, product quality and reliability are increasingly concerned by customers and consumers. Our failure analysis laboratory, against this background, can provide you test and analysis services concerning the following products.
PCB：Rigid PCB, Clad Copper Lamination, Flexible Printed Circuit, Metal Base Lamination, Halogen-free Lamination.Electronic Process Materials：Flux, Solder Paste, Solder Bar/Used Solder, Detergent, Adhesive.PCBA：THT, SMT, BGA, MEMS.
Part and Component：Resistance, Capacitor, Potentiometer, connector, Relay, Switch, Diode, Transistor, MOSFET, Integrated Circuit, Photoelectricity Module, LED Component, Photovoltaic Component.
我们提供的服务包含以下内容： Our service scope：
针对产品研发、试制、生产及来料质量保证方面的性能测试，含机械性能、热学性能、电学性能、化学性能及可靠性评价。
针对电子产品在研发阶段、可靠性测试阶段、客户端使用阶段产生的失效提供分析服务。
针对电子产品的结构可靠性、工艺可靠性、性能可靠性及长期使用可靠性提供产品分析评测服务，帮助企业提高产品质量。
针对供应链产品提供可靠性质量保证测试及分析服务。
Property test in the product development, trial-manufacture, manufacture and quality assurance of giving material, includes: mechanical properties, thermal properties, electrical properties, chemical properties and reliability assessment.
Provide you failure analysis service of electrical products in development, reliability test and customer terminal use phases.Provide you product analysis and assessment services concerning the structure reliability, craftwork reliability, properties reliability and long life cycle reliability of electrical products, to facilitate the promotion of the product quality.Provide you reliability and quality assurance test and analysis services on supply chain products.
电子产品技术服务
Electronic Product Technical Service
PCBA分析、评价 PCBA Analysis & Evaluation
外观检查高温高湿抗拉/剪切强度跌落金相切片锡须观察温度冲击离子清洁度
染色渗透试验
X-ray检查
温度循环
Visual InspectionHigh Temperature and High HumidityPull/Shear TestDropCross Section AnalysisTin Whisker InspectionThermal ShockCleanliness
Dye & Pry Test
X-ray Inspection
Thermal Cycle
PCB机械性能测试 PCB Mechanical Properties Testing
外观检查铜箔抗拉强度及延展率翘曲度拉脱强度金相切片孔隙率
抗剥离强度
镀层附着力
弯曲强度
Visual InspectionTensile Strength and ElongationBow and TwistBond Strength
Micro-sectioning AnalysisPorosity Testing
Peel Strength
Adhesion
Flexural Strength
FAILURE ANALYSIS LAB
07/08
PCB & PCBA 失效分析 PCB & PCBA Failure Analysis
焊接不良表面异物分析板面变色板面氧化腐蚀开路/短路
板面电迁移
漏电
板面起泡/分层
Soldering FailureForeign Material DiscolorationOxidation and Corrosion Open/Short
Electrochemical Migration
Leakage Analysis
Blister/Delamination
PCB热性能测试 PCB Thermal Properties Testing
热膨胀系数
热传导系数热阻玻璃化转变温度热失重温度
热应力热裂解温度
爆板时间(T260/ T288)
阻燃性试验
Coefficient of Thermal ExpansionHeat Conduction CoefficientThermal ResistanceGlass Temperature
Thermogravimetry TemperatureThermal Stress(Td) Decomposition Temperature
Delamination Time (T260/ T288)
Flammability
PCB电性能测试 PCB Electric Properties Testing
耐电压
体积电阻率断路/短路电阻
互连电阻
表面绝缘电阻
Dielectric Withstanding VoltageVolume Resistivity
Open/Short
Interconnection Resistance
Surface Insulation Resistance
PCB可靠性测试 PCB Reliability Testing
可焊性盐雾试验防霉性温度冲击耐溶剂性机械冲击温度循环
振动
吸湿性
耐热油性
SolderabilitySalt MistMildew ResistanceThermal ShockSolvent ResistanceMechanical ShockThermal Cycle
Vibration
Moisture Absorption
Hot Oil Resistance
电子产品技术服务
Electronic Product Technical Service
元器件工艺适用性评价 Components Applicability Evaluation
可焊性清洁度回流敏感度
锡须生长
耐焊接热
BGA植球的剪切强度
端子耐金属化熔解性
SolderabilityCleanlinessMSL
Tin Whisker
Heat Endurance
Shear Strength of BGA solder ball
Resistance to Dissolution of Metallization
元器件结构及失效分析 Component Structure & Failure Analysis
外观检查 (体视显微镜)
电性能测试 (参数测试、功能测试)无损检查（X-RAY 透视检查，SAM）
开封、去层（机械开封、塑封开封、离子蚀刻）
显微观察（体视显微镜、金相显微镜，扫描电子显微镜SEM、显微剖切）失效点定位（探针、电参数测试、红外热像、微光显微分析EMMI）
物理分析、试验验证（X射线能谱仪EDS, 俄歇电子显微镜AES, 二次离子质谱仪SIMS, 原子力显微镜AFM, 透视电子显微镜TEM, 傅立叶红外显微镜FT-IR等）失效机理分析
External Visual Inspection of the Package（Stereomicroscope）
Evaluation of Electrical Characteristics （Electrical Parameters Measurement, Functional Test）Non-destructive Physical Analysis (X-RAY Inspection，Scanning Acoustic Microscope)Package Decapping and Decapsulation of Chips (Mechanical, De-cap Acid and Etching)
Internal Visual Inspection and Failure Locations inside Chips (Stereomicroscope, Metallic Microscope, Scanning Electron Microscope, Micro-cross Section)
Locating Failure point (Probe, Electric Measurement, Infrared Temperature Measurement, Emission Microscope)
Physical Analysis and Structural Analysis (Energy Dispersive Spectrometer, Auger Electron Spectrometer, Secondary Ion Mass Spectrometry, Atomic Force Microscope, Transmission Electron Microscope, Fourier Transform Infrared Spectroscopy, etc.)Failure Principle Analysis
FAILURE ANALYSIS LAB
09/10
导热材料性能测试评价Test and assessment on the
thermal conductive material properties
随着大规模集成电路和微封装技术的发展，电子元器件和电子设备向薄、轻、小以及高频方向发展，电路中元器件的组装密度越来越高，如何散热成为一个影响产品可靠性的突出的问题。导热材料质量的好坏对电子产品的质量与可靠性有着及其重要的影响，因此了解各种导热材料的性能参数及掌握它们的分析检测技术就显得尤为重要。
With the development of large-scale integrated circuit and micro-encapsulation technology, electrical components and facilities are becoming increasingly thinner, lighter, smaller and of higher frequency. With the ever higher component assembling density,
heat dissipation becomes a main problem that affects the product reliability. Since thermal conductive material quality counts a lot in the product quality and its reliability, it is extremely important to understand the property parameters of the thermal conductive material and command relevant test technologies.
电子产品中使用的导热材料包含： Heat-conducting Material in Electronic Product：
金属基电路板、导热胶、热传导胶带、导热填充剂、导热垫、导热相变材料
Metal Base Lamination, Heat-Conducting Glue, Heat-Conducting Tape, Heat-Conducting Stuffing, Chill Bar, Conducting phase-
change Material.
热性能测试 Thermal Properties Testing
热导率
失重温度热裂解温度(Td) 热膨胀系数（CTE）热阻
热应力
玻璃化转变温度
爆板时间(T260/ T288)
Heat Conduction Coefficient
Thermogravimetry Temperature D
ecomposition TemperatureCoefficient of Thermal ExpansionThermal ResistanceThermal Stress
Glass Temperature
Delamination Time
导热材料性能测试评价Test and assessment on the
thermal conductive material properties
物理性能测试 Physical Properties Testing
剥离强度
断裂伸长率 硬度相比耐漏电起痕指数(CTI)阻燃性抗拉强度防霉性吸湿率
永久变形率
密度
Peel StrengthElongationHardnessProof Tracking IndexFlammabilityTensile StrengthResistance to MildewMoisture Absorption
Permanent Set
Density
电性能测试 Electric Properties Testing
体积电阻率击穿电压介质损耗角正切
表面电阻率
介电常数
Volume ResistivityDielectric Withstanding VoltageDielectric Loss
Surface Resistivity
Dielectric Strength
老化试验 Aging Testing
温度循环高温老化温度冲击Thermal Cycle
Aging
Thermal Shock
FAILURE ANALYSIS LAB
11/12
材料及部件性能测试
Materials & Parts Properties Testing
失效分析实验室可以根据标准规定或客户特殊要求对材料或构件性能进行评测，保证您的产品符合使用要求，我们可针对如下产品提供检测及分析服务：
Based on the relevant standards and customers' specific requirements, assessment on the material and component properties can be conducted to make your products satisfy the requirements. We can provide you test and analysis services concerning the following products:
我们提供的服务包含以下内容： Our services：
针对金属和镀层在生产和使用中出现的失效提供分析服务。
针对金属和高分子材料及构件在生产及来料质量保证方面的性能测试，含机械性能、热学性能、电学性能、化学性能及微观结构分析。
针对供应链产品提供可靠性质量保证测试及分析服务。
Failure analysis on the metal and coating in manufacture and usage.
Property test of metal and polymer material and its component in manufacture and quality assurance of giving material; includes mechanical properties, thermal properties, electrical properties, chemical properties and micro-structure analysis. quality assurance test and analysis services on supply chain products.
金属材料及部件性能测试评价
Materials & Parts Properties of Metal
金属材料及构件失效分析 Failure Analysis of Metallic Material
成分定量分析
成分定性分析断口微观形貌金属材料断裂失效分析 磨损失效分析腐蚀失效分析
断口宏观形貌
断口金相分析
Quantitative InvestigationQualitative InvestigationMicroscopic View of FractureFailure Analysis of Metal FractureFailure Analysis of Wear
Failure Analysis of CorrosionMacroscopic View of Fracture
Metallographic Analysis of Fracture
金属材料微观组织分析 Micro-structure Analysis of Metal
金相分析表面残余应力分析热处理组织分析X射线相结构分析
金属材料晶粒度
镀层厚度测试
Metallographic AnalysisSurface Residual Stress AnalysisHeat Treatment MorphologyPhase Structure with X-RAY
Crystal Grain of Metal
Coating Thickness
材料机械性能测试 Mechanical Properties Testing
拉伸试验零部件清洁度硬度测试弯曲试验
冲击试验
密度
Tensile TestCleanliness of PartsHardness TestBending Test
Impact Test
Density
材料热学性能测试 Thermal & Electric Properties Testing
熔点比热容热传导系数热膨胀系数
弹性模量热阻
Melting Point
Specific HeatHeat Conduction CoefficientCoefficient of Thermal Expansion
Elastic Modular
Thermal Resistance
FAILURE ANALYSIS LAB
13/14
高分子材料及部件性能测试评价 Materials & Parts of Polymer
材料机械性能测试 Mechanical Properties Testing
拉伸试验磨擦试验冲击试验附着力弯曲试验密度
硬度测试光泽度
压缩试验
零部件清洁度
撕裂试验
Tensile TestAbrasionImpact TestAdhesive ForceBending TestDensity
Hardness TestGloss Properties
Compression Test
Cleanliness of Parts
Tearing Test
材料热学性能测试 Thermal Properties Testing
熔点阻燃性
热阻
热膨胀系数维卡软化点温度玻璃化转变温度熔融指数比热容弹性模量热失重温度
热传导系数
低温脆化温度
Melting Point
Flammability
Thermal Resistance Coefficient of Thermal ExpansionVicat Temperature Softing PointGlass TemperatureFusion Index
Specific Heat
Elastic Modular
Thermogravimetry Temperature
Heat Conduction Coefficient
Low Temperature Brittleness
材料电性能测试 Electric Properties Testing
表面电阻率介电强度体积电阻率击穿电压
介电常数
耐电压
介电损耗角正切
Surface ResistivityDielectric StrengthVolume ResistivityBreakdown Voltage
Dielectric Constant
Withstand Voltage
Dielectric Loss
涂/镀层性能测试分析 Coating/Plating Testing and Analysis
切片硬度纳米压痕防霉性X射线耐盐雾性耐磨性耐化学试剂性耐冲击性结合力粗糙度表面形貌耐光性可焊性失效分析耐腐蚀性
空隙性
耐油品性
Cross Section for ThicknessHardness
Nano-indentationMildew ResistanceX-Ray for ThicknessSalt Spray Resistance Abrasion ResistanceResistance to Chemical
Resistance to shockAdhesive ForceRoughness (Contact, Noncontact)Surface TopographyPhotostabilizationSolderabilityFailure AnalysisResistance to Corrosion
Porosity
Resistance to Oil
胶带性能测试 Tape Testing
厚度拉伸强度氙灯加速老化剥离强度伸长率耐老化初粘性防水性击穿电压持粘性
水汽透过性
阻燃性
ThicknessTensile StrengthXenon-Arc Exposure
Peel AdhesionElongation
Resistance to Accelerated AgingTack
Water Penetration RateDielectric Breakdown Voltage
Holding Power
Water Vapor Transmission
Flammability
FAILURE ANALYSIS LAB
15/16
清洁度测试Cleanness Testing
零部件清洁度 Cleanness Test of Partial Component
随着产品的不断小型化及包装质量要求的提高，其技术要求也更加严格，尤其是引起零部件功能损耗的灰尘颗粒，微机械零件对污染物产生的颗粒及其敏感，清洁度决定了设备性能和使用寿命，故颗粒污染物需要得到可靠精密的探测。许多工
业部门都已经认识到，他们需要适当的书面材料来证明其零部件及清洗液的纯净度。
With the miniaturization of products and promotion the package quality, severe technology requirements are needed. For instance, dust particles can damage the partial component function. Since micro mechanic components are rather sensitive to the contaminant particles, the cleanness determines the performance and life cycle of the equipment. Therefore, accurate test are required. It is acknowledged in many industrial departments, proper written documents are needed to testify the pureness of the partial components and cleaning solution.
适用于：精密零件及组件，发动机零件，如变速箱, 引擎, 曲轴杆 和凸轮轴等。
Apply to: precision component and assembly, motor component, gear-box, engine, axostyle and camshaft.依据标准：ISO4406、ISO4407、ISO16232、NAS1638、ASTM D4378-03、VDA19、GB/T 14039、JB。Reference standard：ISO4406、ISO4407、ISO16232、NAS1638、ASTM D4378-03、VDA19、GB/T 14039、JB.
PCB/PCBA离子清洁度 Cleanness of PCB/PCBA
随着高性能、高可靠性电子产品对PCB/PCBA的质量要求日益严格，清洁度作为评价PCB/PCBA质量的关键参数之一，是检验PCB表面残留离子的程度，防止腐蚀失效和电迁移失效的发生。
With the promotion of PCA/PCBA quality requirement brought by the highly performed and reliable electrical products, cleanness becomes one of the crucial parameters to assess PCB/PCBA quality. Cleanness is to test the residual icon on the PCB surface, to prevent from fretting failure and electron transmission failure.
J-STD-001要求所有电子类别的产品转配后的离子含量
J-STD-001 the icon amount of the electric products after transmission is required less than
失效分析实验室
IPC-TM-650 2.3.28要求检测PCB/PCBA表面残留的离子有：
IPC-TM-650 2.3.28 Residual icons on the PCB/PCBA surface are:
依据标准：IPC-6012、J-STD-001、IPC-TM 650 2.3.25/2.3.28、MIL-STD-2000 等。
Reference standard：IPC-6012, J-STD-001, IPC-TM 650 2.3.25/2.3.28, MIL-STD-2000 and so on.
技术支持
Technical Support
技术支持服务将针对您的产品从研发、试产到生产中的质量及可靠性保证提出指导服务。主要涵盖产品质量可靠性评估方案的设计、实施及分析，失效产品分析服务，产品分析评测服务，技术咨询、合作及培训，同时依托CTI强大的技术能力及服务网络，为您的产品提供一站式服务。使您的产品既能符合市场需求，又能符合相关法令法规要求，从而完善您的品牌，提升您产品的市场竞争力。
Technical support will be given to your products featuring quality and reliability assurance in the development, trial-manufacture and manufacture phases. The support covers: design of the product quality and reliability assessment solutions, application and analysis, failure analysis, product analysis and assessment services, technical consultation, cooperation and training, and provide you one-stop service against the strong CTI technical strength and service network. We aim to facilitate your products meeting the market needs and the relevant regulations and requirements, so as to perfect your products and promote your product competitiveness.
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可靠性分析测试中心联系方式 Reliability Analysis Testing Center CS Contact
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